New Arrivals/Restock

Chip Quik TS391SNL10 Thermally Stable Solder Paste No-Clean Sn96.5/Ag3.0/Cu0.5 T4 (35g syringe)

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Product details

Management number 221722414 Release Date 2026/05/03 List Price $21.24 Model Number 221722414
Category

Chip Quik TS [Thermally Stable] Solder Paste No-Clean Lead-Free SAC305 in 10cc syringe 35g w/plunger & tip. Revolutionary Formula: No Refrigeration Required! Alloy: Sn96.5/Ag3.0/Cu0.5 Flux Type: Synthetic No-Clean Flux Classification: ROL0 Metal Content: 87% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 217-220C (423-428F) Size: 10cc/35g syringe Shelf Life Refrigerated >12 months, unrefrigerated >12 months Stencil Life >12 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Store at room temperature 20-25C (68-77F). Do not freeze. Chip Quik Thermally Stable solder paste should be stored at its operating temperature (room temperature) of 20-25C (68-77F), therefore no warming time is required before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.

  • Thermally Stable
  • SAC305
  • RoHS
  • Lead-Free
Material metal
Item Weight 1.23 ounces
Part Number TS391SNL10
Manufacturer Chip Quik®
Item model number TS391SNL10
Batteries Included No
Batteries Required No
Package Dimensions 6 x 3 x 1 inches

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